Prospects and Forecast of the Development Scale of Shanghai's IC Industry in 2018

The general idea of ​​Shanghai IC industry development in 2018.

(1) Give full play to the major role of the integrated circuit industry as a national strategic, basic, and leading industry, and continue to provide and meet mobile intelligent terminals, network communications, industrial intelligent manufacturing, Internet of things, automotive electronics, information security, cloud computing, The development needs of emerging industries such as big data, artificial intelligence, smart medical care, satellite navigation, smart homes and smart consumer electronics.

Deepen the integration of the "13th Five-Year Plan for the National Economic and Social Development of the People's Republic of China", the "China Made 2025" national strategy, and advance the strategic deployment of supply-side structural reform [1, 2], focusing on enhancing the basis of integrated circuits. Support capacity, focus on upgrading the application level of integrated circuits, focus on exploring new models for industrial development, focus on creating a favorable environment for industrial development, and focus on nurturing new kinetic energy for economic growth, in order to promote China’s economic and social development and build new competitive advantages in China’s manufacturing industry for Shanghai and The national integrated circuit industry made new contributions.

(2) Continuously enhance the sustainable development capability of the Shanghai integrated circuit industry. From 2017 to 2018, the average growth rate of the industry will be maintained at 15% to 20%, and on the basis of increasing industry growth rate by 20% to 22% from 2019 to 2020, efforts will be made to promote IC design technology and chip manufacturing technology to reach the international advanced level and domestic leading level. We are striving to promote the integration of packaging and testing technology with the world's advanced level; major equipment and key materials have not only entered domestic IC large-scale production line applications, but have gradually entered the international procurement system. Efforts were made to realize the coordinated development of the four industries of the IC design industry, chip manufacturing industry, packaging and testing industry, and equipment and materials industry.

(3) Continue to improve the layout of Shanghai's IC industry. Through the strengthening of investment and enterprise integration and restructuring, we will vigorously build a new enterprise group in the design, chip manufacturing, packaging and testing, equipment and materials industries and integrated circuit supporting services. We vigorously supported several key enterprises in various industries to become bigger and stronger, and gradually entered the top 10 global rankings.

Leading the Shanghai IC industry and various companies to innovate and brave to practice leap-forward development, on the basis of bigger and stronger companies, we will strive to make the Shanghai integrated circuit industry bigger and stronger. Finally, the IC industry in Shanghai has been built into an integrated circuit industry system with novel architecture, advanced technology, autonomous control, and security.

(4) Strengthen cooperation and cooperation with international advanced manufacturers and domestic brother enterprises, accelerate system and mechanism innovation and technological innovation, further attract domestic and foreign investment, attract talents at home and abroad, absorb the successful experience of IC industry development, and fully grasp development integration. The scientific laws of the circuit industry, on this basis, strive to create new experiences for the rapid and efficient development of the integrated circuit industry.

Fully committed to accelerate the construction and commissioning of the 12-inch wafer production line for SMIC (Shanghai) and Shanghai Huali Microelectronics Phase II. Shanghai strives to remain at the top of the nation in the current round of domestic wafer production line development. .

2 Outlook and Forecast for the Scale of Shanghai IC Industry in 2018

According to the “13th Five-Year Plan” development goals of the Shanghai IC industry, and the current implementation of major investment projects in the IC industry in Shanghai and the development trend of IC industry at home and abroad, the prediction of the scale and growth rate of the IC industry in Shanghai from 2016 to 2020 As shown in Table 1 [3].

In 2016, the sales volume of the IC industry in Shanghai exceeded 100 billion yuan for the first time, an increase of 10.8%, setting a good start for the industry to implement the “Thirteenth Five-Year Plan”. Construction of the 12-inch wafer production line for SMIC (Shanghai) and Huali Microelectronics Phase II began. The SMIC (Shanghai) 28 nm process and Huali Microelectronics' 40 nm process continued to expand. A batch of technology-leading design companies such as Spreadtrum Communications, Fudan Microelectronics, and SMIC Semiconductors have consistently introduced high-end chips such as advanced 4G LTE smart phone baseband chips, international general-purpose IC cards, and X86 architecture general-purpose processors. High-end advanced equipment and key materials researched and produced by a batch of semiconductor equipment materials companies such as China Microelectronics, Shanghai Microelectronics Equipment (Group), Shanghai Xinyang Semiconductor Materials, Shanghai Anji Microelectronics and Shanghai Xinao Technology have continuously passed certification and entered the market. The rapid growth of the integrated strength of many IC companies in Shanghai has become a solid foundation for the sustained and rapid growth of the Shanghai IC industry and the realization of the “Thirteenth Five-Year Plan” target.

At the same time, as can be seen from Table 1, during the “13th Five-Year Plan” period, the growth rate of the development of the IC industry in Shanghai is gradually increasing. After the accumulation and advancement from 2016 to 2018, the Shanghai integrated circuit industry will achieve an average annual growth rate of 20% from 2019. By 2020, the sales volume of the Shanghai integrated circuit industry will reach or exceed 200 billion yuan, which will successfully achieve the grand goal of developing the “13th Five-Year Plan” of the IC industry in Shanghai.

The sales scale and growth rate of various industries in Shanghai IC from 2016 to 2020 are shown in Table 2. It can be seen that after two consecutive years of rapid growth between 2017 and 2018, the IC design industry in Shanghai will reach 52 billion yuan by 2018, the chip manufacturing industry will reach 36.0 billion yuan, and the packaging and testing industry will also reach 36.0 billion yuan. The industry reached 16 billion yuan, which laid a solid foundation for greater growth after 2018. To achieve the "13th Five-Year Plan" goals, we have truly played an important role in linking up with the past and opening the door to the future.

Figure 1 shows a comparison of the structure of the IC industry chain in 2016 and 2020 in Shanghai. By 2020, IC design industry will still be the largest industry in the IC integrated circuit industry chain in Shanghai, accounting for 34.8% of the industry chain, up to 37.3% in 2020. The scale of the chip manufacturing industry will exceed the scale of the package testing industry. By 2020, the two industries will each occupy 27.4% and 22.4% of the industrial chain. By 2020, the proportion of the equipment and materials industry to the industrial chain will increase from 10.7% in 2016 to 12.9%. Shanghai's integrated circuit industry chain structure is more advanced and reasonable.

3 Prediction of the Development of the Technology Level of Shanghai's IC Industry in 2018

3.1 IC Design Industry

With the further maturation of SMIC (Shanghai) and Huali Microelectronics' 28 nm process, and the technological advancement of IC design companies, the mainstream technology of Shanghai IC design industry will advance from the 40 nm node in 2016 to the 28 nm node in 2018. . Technology-leading design companies, such as Spreadtrum Communications, will advance from 16/14 nm technology to 10 nm technology.

With the booming market of the Internet of Things, automotive electronics, industrial control, wireless communications and wearable device chips, chip design technologies such as low power consumption, high reliability, power integration, and RF RF will occupy an important position. The combination of these chip designs and the wafer foundry companies' unique processes has become even closer. By 2018, the design and manufacturing technologies of Shanghai analog chips, digital-analog hybrid chips, embedded non-volatile memory, and embedded microprocessor SoC chips will reach internationally advanced or internationally advanced technologies.

3.2 IC Manufacturing

By 2018, the 12-inch wafers of 28nm PolySiON and HK/MG of SMIC (Shanghai) and Huali Microelectronics will become more mature. The 16/14 nm advanced process of SMIC (Shanghai) was successfully developed, introduced into mass production, and developed 10nm and 7nm process technologies.

At the same time, with the further expansion of the market demands for the Internet of Things, automotive electronics, industrial control, wireless communications and artificial intelligence, the sensor (MEMS) manufacturing technology, power integration process technology, low-power MCU process technology, SiGe BiCMOS process technology and Significant technological processes, such as high-voltage, high-current new-type power devices, will reach the same level as advanced international manufacturers, and the importance and market demand for 8-inch featured processes will become more prominent. At that time, SMIC (Shanghai), Huahong Hongli, TSMC (China) and Shanghai's advanced 8-inch wafer production lines will remain "young."

3.3 IC Package Testing Industry

As the current IC packaging and testing companies in Shanghai are basically foreign-invested companies, they have little say over the technological development of the packaging and testing companies. In the next few years, Shanghai IC's requirements for packaging and testing technology and production capacity will be to strengthen cooperation with foreign packaging and test manufacturers in the city, and to jointly establish high-end advanced packaging production lines with major domestic packaging and testing companies (such as SMIC Changjiang Electronics has established a 12-inch bump Bumping production line of SMIC Changjiang Electronics Co., Ltd. to jointly promote the simultaneous development of packaging and testing technology and design and manufacturing technologies and the simultaneous development of industrial chains [4,5].

In 2018, based on SMIC's 12-inch 14 nm bump production technology, it will further promote Flip-Chip technology and TSV (silicon through-hole) technology in advanced packaging. 2.5 The D/3D stacking chip technology and SiP (system-in-package) technology have gradually matured and are being introduced into large-scale mass production. As a result, Shanghai's high-end advanced packaging technology is being synchronized with world-leading technology vendors.

3.4 IC Equipment Materials Industry

In 2018, Shanghai's semiconductor equipment and materials industry first focused on promoting the successful application of 45- to 28-nm-level process equipment and ancillary materials to large-scale production lines to promote the timely application of innovative semiconductor materials in the city during the “Twelfth Five-Year Plan” period. productive forces. On this basis, we will further implement the “Thirteenth Five-Year Plan” project of the National Science and Technology Special Project 02 to raise the level of R&D and industrialization of major equipment and key materials to a new level of 14 to 10 to 7 nm. Further in high-end equipment such as 14 to 7 nm dielectric etchers, advanced packaging lithography machines, 28 nm immersion lithography machines, next-generation megasonic wave cleaners, IC chip thin film inspection, defect detection, and CMP polishing fluids, High-purity metal plating solutions, 12-inch silicon polishing wafers, epitaxial wafers and SOI wafers and other key materials have made Shanghai the leading features.

4 Key Measures and Suggestions for Promoting the Development of Shanghai's IC Industry in 2018

4.1 Scientific planning and coordination of the industry

Under the unified leadership of the Shanghai Integrated Circuit Industry Development Leading Group, we will continue to do a good job in the development of the Shanghai IC industry's scientific planning, decisive decision-making, and key coordination.

Since the Shanghai Integrated Circuit Industry Development Leading Group was established on August 8, 2015, the Shanghai integrated circuit industry has entered a new phase of orderly and rapid development. With the emergence of new developments, new situations and new tasks in the domestic and international integrated circuit industries, the Shanghai integrated circuit industry under the unified leadership of the Shanghai Integrated Circuit Industry Development Leading Group has made timely progress in the top-level design of the development of the integrated circuit industry in Shanghai. Timely planning of the major development directions of Shanghai's IC industry at various stages of development, rationalizing the new layout of the Shanghai IC industry, making decisions on major projects of the Shanghai IC Industry Development Investment Fund, and coordinating the relevant government offices of the municipal government to further implement the state and municipal governments Industrial policy measures. Under the new circumstances, in order to retain Shanghai enterprises, Shanghai personnel, attract foreign investment (including other provinces and cities to invest in Shanghai), attract talents (including talents from other provinces and cities), formulate various new policies that adapt to the new era and have Shanghai characteristics. New measures.

In order to develop the IC industry in Shanghai better, we suggest that it is necessary to set up an expert committee for the development of the Shanghai IC industry to study and formulate the direction of industry and technology development at various stages of the development of the IC industry in Shanghai and consult the major decisions of the city government. , To carry out pre-research on the development direction and major technical arrangements of the Shanghai IC industry in the next 5 years and 10 years, to ensure the continuous, orderly, healthy and steady development of the IC industry in Shanghai, and to catch up with and surpass the advanced world of the IC industry in Shanghai Make new contributions horizontally.

4.2 In the field of IC design

Scientifically plan the development of chips in important areas such as mobile smart terminals, network communications, automotive electronics, Internet of Things, industrial control, wearable devices, smart manufacturing, artificial intelligence, information security, cloud computing, big data, and new consumer electronics. Organize rational division of labor among IC design companies in the industry to avoid disorderly competition. Strengthen the construction of public platforms, upgrade the common technical level of IC design, organize the sharing of intellectual property rights, encourage IC design companies and wafer foundry companies, and package and test companies to form industrial chain alliances, and upgrade the overall level of the integrated circuit industry chain in Shanghai.

Encourage design companies to join forces and mergers and acquisitions to strengthen the overall strength of design companies. Formulate and implement new policies and measures to retain talents and attract talents, and to lay a solid foundation for the IC design industry in Shanghai and foster several IC design companies with worldwide influence.

4.3 In the field of chip manufacturing

Focusing on the construction of the 12-inch production line for SMIC (Shanghai) and Huali Microelectronics Phase II, and planning the construction of the second 12-inch wafer production line for the two companies, and vigorously expanding SMIC (Shanghai). 28 nm process and Huali Microelectronics 40 nm process capability. We will vigorously expand the production capacity of Huahong Hongli's unique technology and build Shanghai's advanced production base for new power devices. We encourage TSMC (China) 8-inch production lines to upgrade and expand production.

We will strengthen the alliance with the world's advanced semiconductor manufacturers, strive to complete the 16/14 nm process technology development and production as soon as possible, and organize the development of 10 nm and 7 nm process technology research and pre-study of the 5 nm process technology. Organizational forces explore new technologies such as nanowire transistors, photonic integrated circuits, and quantum devices. Realize 28nm and below technology node R&D, production and mature process upgrade and expansion. The Shanghai chip manufacturing industry will be built into a chip manufacturing enterprise group with the most advanced technology and largest production capacity in China.

4.4 In the area of ​​package testing

Encourage IC design companies and wafer manufacturing companies to integrate upstream and downstream industry alliances with packaged test companies in this Municipality and other provinces or cities, or establish joint ventures to establish advanced packaging and test production lines to ensure advancement of packaging and testing technologies and packaging and test production capacity. Encourage the use of advanced packaging as much as possible to encourage the development of high-end packaging technology. Established advanced packaging labs in large wafer foundry companies such as SMIC (Shanghai), Huali Microelectronics, and Huahong Hongli to conduct "through-train" services for wafer foundry and chip packaging testing, and try to design ICs as much as possible. And chip manufacturing adopts advanced package testing technology to upgrade the overall manufacturing technology of Shanghai integrated circuit products.

4.5 In the field of semiconductor device material manufacturing

All measures shall be taken to ensure that Shanghai Microelectronics Equipment (Group) Co., Ltd. completes the national science and technology major task such as the successful development and industrialization of the 28 nm node immersed step-and-repeat projection lithography machine according to quality, quantity, and time. The lithography equipment is a landmark project of China's National Science and Technology Major Special Project during the “Thirteenth Five-Year Plan” period, which affects the overall situation of the overall deployment of China’s semiconductor equipment R&D and industrialization during the “Thirteenth Five-Year Plan” period, and is also the “Thirteenth Five-Year” period. China's semiconductor equipment manufacturing industry, a landmark achievement.

Shanghai's semiconductor equipment and materials companies are encouraged to upgrade R&D and industrial equipment and materials products to the 16/14 to 10 to 7 nm technology generation. Encourage semiconductor equipment materials companies and wafer manufacturing companies, packaging and testing companies to form an upstream and downstream industrial chain alliance, encourage various types of integrated circuit companies to use domestic equipment and domestic materials as much as possible, and to ensure that the policy measures and economic measures. At the same time, the third generation of semiconductor materials, graphene materials, high-end photoresists and masks were developed and industrialized.

Encouraging Shanghai's semiconductor equipment and materials companies to form a strategic alliance with IC design companies, chip manufacturing companies, and parts supporting companies on the basis of independent development and multi-party cooperation to create a synchronized development of equipment and key parts and components, key materials and foundations. The prosperity of the common development of raw materials.

It is recommended that when the conditions are ripe, Shanghai IC High-end Equipment Group Co., Ltd. can be established to capitalize on the link and achieve the goal of realizing the localization of high-end integrated circuit equipment, in order to further expand the overall strength of the Shanghai integrated circuit equipment enterprise, and comprehensively enhance the integration of Shanghai. The role and position of high-end equipment industry in promoting the development of integrated circuits industry in China and Shanghai.

4.6 Further Strengthening the Development Environment of Shanghai's Integrated Circuit Industry

In 2018, under the unified leadership of the Shanghai Leading Group for the Development of Integrated Circuit Industry and under the leadership of the municipal competent authorities, the national and municipal IC industry development guidelines and policies were further implemented to expand the integration of investment channels. Capital investment, make good use of national "big funds" and Shanghai local industrial investment funds, strengthen the functional measures of various industrial parks to promote the development of the integrated circuit industry, highlight the park function of Zhangjiang National Independent Innovation Demonstration Zone, and strengthen the construction of industry-related public platforms. We will continue to implement the policy of opening up to the outside world, strengthen the attraction of foreign investment and attract human resources policy implementation. With the help of Shanghai's construction of a world-impact science and technology innovation center, Shanghai's integrated circuit industry will be driven. During the “Thirteenth Five-Year Plan” period, it will create a superior industrial environment for the development of the integrated circuit industry in Shanghai and will be more conducive to encouraging innovation and development.

5 Conclusion

The next 3 to 5 years will be a major opportunity period and a major transition period for the development of the IC industry in Shanghai. Shanghai, as an important industrial base with the most concentrated IC industry in China, relatively complete industrial chain, and relatively highest comprehensive technology, should achieve a breakthrough that is more large-scale, more innovative, and more effective [6].

Shanghai should closely integrate national strategies such as "Made in China 2025" and "Internet Plus", strive to achieve the "Outline for the Promotion of the National IC Industry Development", the "Thirteenth Five-Year Plan for Development of the Information Technology Industry" and "Shanghai's IC Industry To develop the goals of the "13th Five-Year Plan". Looking ahead to 2018, there will be a larger-scale breakthrough in the scale of production capacity and technology of ICs in China and Shanghai. The scale of the IC industry in Shanghai has further exceeded RMB 200 billion, which will make it possible.