In recent years, German scientists have developed a new type of heat dissipation material. It is composed of two components of diamond and copper after special treatment. The heat dissipation efficiency of the composite material is higher than that of copper and aluminum, 1.5 times that of copper, and the cost Dropped significantly. However, it is not easy to prepare diamond / copper-based composite materials with stable quality. The graphitization and compactness of the composite materials restrict the application of diamond / copper-based composite materials. Nevertheless, the heat dissipation material obtained by combining copper and diamond has the characteristics of copper and diamond. This new composite material not only has the advantages of high electrical conductivity, high thermal conductivity, high strength and low price, but also can overcome the inherent strength of metallic copper itself. The shortcomings of low wear resistance and poor wear resistance can replace the widely used heat dissipation materials such as Cu, W-Cu, Al / SiC, and AlN. It is one of the effective methods to solve the current heat dissipation problems of electronic devices and is also a hot spot in the current electronic packaging industry. In this paper, based on the synthesis of a large number of literatures, the research on the characteristics and preparation process of diamond particle reinforced copper-based heat dissipation materials is reviewed, and the current problems and development trends of diamond / copper-based heat dissipation materials are proposed.
Diamond particles enhance the performance of copper-based heat dissipation materials. Diamond / copper-based composite heat dissipation materials use diamond as the reinforcing phase and compound with the copper-based alloy to form an incompatible composite material, thereby combining the excellent thermal conductivity of the copper matrix with the reinforced diamond The combination of low expansion, low density and high thermal conductivity. It has the following advantages: (1) high thermal conductivity, which can reach more than 600W / mK; (2) thermal expansion coefficient can be adjusted, the expansion coefficient of the composite material can be adjusted by changing the mass fraction between diamond and Cu components, It is beneficial to match the thermal expansion coefficient of Si, GaAs and other semiconductor materials; (3) The density is small, 5 ~ 6g / cm (4) The processing performance and plating performance are good, and the composite material can be subjected to conventional wire cutting and grinding. And can be coated on the surface; (5) Good wear resistance, fatigue and fracture toughness. Table 1 lists the performance comparison between diamond / copper matrix composites and other diamond / metal matrix composites. From the current research status, diamond / copper-based composite materials have become the most popular composite material in the research of diamond / metal-based composite materials at home and abroad, and have been widely used in automotive, electronics, aerospace and other fields. The performance of electronic components and equipment plays a huge role.
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