Definition of Paiboard:
Before lamination of the multilayer board or substrate, various bulk materials such as the inner layer board, prepreg and copper sheet, steel plate, kraft paper padding, etc., need to be aligned up and down, or registered, and wait to be sent in The pressing machine performs hot pressing, and this kind of preparatory work is called platooning.
Substrate used for layout:
The base material is also called copper clad laminate, which is the raw material for printed circuit boards with different specifications and thicknesses made by bonding copper foils together under high temperature and high pressure through prepregs.
Copper foil used for row board:
There are two main types of copper foil used in the PCB industry: electroplated copper foil and rolled copper foil.
Usually used is electroplated copper foil, one side is smooth, called DrumSide, and the other side is rough crystal surface, called MatteSide.
Prepreg used for layout:
The prepreg (Prepreg is the abbreviation of Pre-pregnant) is a kind of sheet-like bonding material synthesized by resin and carrier.
A. Resin: It is a kind of thermosetting material, which is a high molecular polymer, and epoxy resin is commonly used at present.
B. Glass fabric (Glassfabric): It is a kind of reinforcement material formed by the interweaving of warp yarns and weft yarns after being fused at high temperature and then cooled into a non-crystalline hard state.
Types of plate pressing:
Large-scale depressurization method. (MassLam)
The inner layers and sandwich prepregs are first positioned and riveted with hot melt\rivets, and then subjected to high temperature pressing after adding copper skin. This simplified, rapid and enlarged area pressure discharge method can also be based on the substrate type. The method of increasing the number of "openings" (Opening), which can reduce labor and increase production, is called the large-scale depressurization method.
Pin nail pressing method. (PinLam)
The inner layer boards, prepregs and copper skins are first positioned with pin nails, and then pre-stacked for high-temperature pressing. This small-area pressure relief method is called pin nail pressing.
The layout process (MassLam)
Automatic copper foil cutting: automatic reflow system, copper foil size is fixed at 1118*1280mm.
Cut the prepreg: Cut the prepreg to the required size.
Drilling positioning holes for prepregs: punch holes according to the spacing, number, location and size of the positioning holes used for pre-stacking.
Hot melt\with rivets: Fix between layers at the location of the positioning holes used for pre-stacking.
Steel plate cleaning treatment: through mechanical grinding method, remove the glue stains and slight flower marks on the surface of the steel plate used before pre-stacking.
Kraft paper: material for heat insulation and pressure cushioning.
Pre-stacking: manually stack the inner board and prepreg together
Arrange the boards: place the pre-stacked boards, and place the copper foil, steel plate, and kraft paper through the automatic reflow line in order to arrange the boards.
Definition of pressing process:
The arranged boards are bonded together under the conditions of high temperature, high pressure and no vacuum, to form a multilayer circuit board, which is called the hot pressing method.
Process conditions:
Provide the temperature required for the prepreg to change from a solid state to a liquid state, and then polymerize.
Provide the pressure required for the liquid resin to flow and fill the line space.
Provides the vacuum required for volatile components to flow out of the board.
Pressing process:
Press board: Press the arranged circuit board under the action of the set temperature and pressure.
Dismantling the board: Separate the pressed and heat-dissipated board from the steel plate through the automatic reflow disassembly system.
Sub-board: Separate the board from the board according to the size of the PNL board.
X-Ray Drilling: Use the perspective effect of X-ray and mark position confirmation to drill positioning holes for drilling in the next process.
The gong board edge: according to the requirements of the engineering data, the irregular flow glue edge of the press board is trimmed with a gong machine to fix the same model size.
X-Ray drilling:
Through the X-ray transmission of the machine, project through the surface copper skin to the inner target, and then use a drill to drill the positioning hole at the corresponding position of the target
The role of positioning holes:
Alignment of each inner layer in a multilayer board.
At the same time, it is also a positioning hole made in the outer layer, which serves as a reference for the alignment of the inner and outer layers.
The third hole is an anti-reverse hole to determine the direction of the board.
X-Ray drilling icon:
Trimming:
According to MI requirements, trim the edge of the semi-finished board after pressing to the required size.
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