Recently, ON Semiconductor, which promotes energy-efficient innovation, has introduced the industry's most accurate optical image stabilization (OIS) integrated circuit (IC) for smartphone camera modules. This highly integrated LC898111AXB-MH solution delivers industry-leading precision and low power operation in a compact footprint.
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The LC898111AXB-MH combines the controller and driver functions required to process OIS in a smartphone camera module. The significantly increased shutter speed makes exposure compensation far superior to competing OIS solutions. Therefore, it can achieve precise suppression control of camera picture vibration. In addition, it can also be used to achieve the left and right and up and down adjustment functions that are indispensable for shooting while walking. The output of this IC's integrated pulse width modulation (PWM) driver reduces power consumption and mitigates the effects of noise on image quality. This highly integrated, pre-programmed IC allows engineers to minimize the number of external components required in system design, thereby reducing overall energy consumption and board space.
"The need to improve the camera performance of the latest smartphones is increasing as consumers expect more and more good camera functions," said Watanabe Watanabe, director of the Power Solutions Business Unit at ON Semiconductor's Smart Power Solutions Division. "Mobile phone manufacturers need to specify A higher resolution CMOS image sensor with higher OIS accuracy. This compact, highly advanced, energy-efficient single-chip solution helps design smarter, yet more powerful smartphones. The innovative LC898111AXB-MH IC It has been adopted by leading smartphone manufacturers and is currently being used in the highest resolution smartphones on the market today."
The LC898111AXB-MH includes a variety of digital and analog audio processing mechanisms, including dual-channel position sensing circuitry, gyro filter interface circuitry, and lens servo circuitry. The position sensing circuit includes a Hall amplifier circuit, a constant current digital-to-analog converter (DAC), a gain control operational amplifier, and a 12-bit analog-to-digital converter (ADC) for each channel. The gyro filter interface circuit is fully compatible with analog and digital signals. The gyro filter interface and lens servo circuit can be adjusted through I2C and SPI bus interface, and can provide various configurations when connecting different gyros and actuators. Therefore, the device can cover a wider range of flutter frequencies and thus provide a larger image stabilization angle.
ON Semiconductor plans to expand the range of products to the LC898119XC-MH, which offers the industry's smallest chip size (2.0mm X 2.0mm X 0.675mm) and offers extremely low power consumption.
Packaging and price
The LC898111AXB-MH is available in a compact (2.57 mm x 3.22 mm x 0.69 mm), leadless/halogen-free 48-pin WLP package and is priced at $2.30 in 4,000-piece quantities.
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