Molex, the world's leading supplier of complete interconnect products, announced the launch of new LED array base technology with complete electrical, mechanical, and optical connectivity to achieve optimal performance and simplify design integration for luminaire manufacturers. In the existing LED array solutions, LED array metal printed circuit boards or ceramic array substrates often require a compromise between the cost-saving small lampholder substrate size and the required optical performance, while providing integrated electrical , Mechanical and optical characteristics for use in lighting systems. Molex's new technology transfers connectivity and ease of use from the LED array substrate to a discrete plastic substrate, thereby improving heat dissipation, optical and mechanical interconnection functions. This plastic substrate can be combined with the LED array package in various ways to provide the top surface of the LED array with multiple connection options.
This new technology co-developed with Bridgelux has been integrated into Bridgelux's recently released Vero * array products. This new interconnection technology is expected to make future LED array products easier to integrate and more cost-effective, allowing lighting OEMs to reduce the system cost of LED luminaire design, speed time to market and increase reliability. These technological advancements include thermally insulated solder tabs, a Molex Pico-EZmate connector, and improved mechanical attachment and optical reference characteristics while maintaining extremely low side heights. Compared with the existing LED array packages that need to be welded to aluminum or ceramic materials, the new product's solder pads are designed to simplify the direct soldering process and improve robustness. The Pico-EZmate connector connector option implements a solderless electrical interface and facilitates field repair and replacement.
Jim Miller, Director of Sales and Marketing at Bridgelux, said: "The new interconnection technology is a major advancement in LED light source packaging, which simplifies our customers’ various immediate system integration issues and helps usher in the era of smart lighting systems. We know the field of solid-state lighting The emergence of technology convergence is not too far away, as is the case in the field of consumer electronics. Fusion requires the integration of more functionality, sensors, communications and other features into the LED lighting engine. This advanced platform technology is very suitable for the use of new Product architecture to achieve integration. "
This plastic case interconnect technology is based on Molex's technology for consumer electronics and other high-volume markets. Molex will provide a wide range of UL-certified Pico-EZmate patch wiring harness products that can use the entire Vero product line to provide a cost-effective way Simple and stable interconnection system.
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