The wireless network chip co-designed by Canxin, Open-Silicon and HiSilicon was successfully launched in one shot.
Hisilicon Semiconductor Co., Ltd., Cancore Semiconductor (Shanghai) Co., Ltd. and Open-Silicon Corporation of the United States announced that they have jointly completed the design of a wireless network chip, and successfully succeeded in the first chip launch on TSMC's 65-nanometer process. This system-on-chip SoC was fully designed and taped out in September 2009. The entire process from the initial netlist delivery to the tape out (Taepout) took only 4 months, and it completely satisfied Hisense ’s urgency. The requirements of the time schedule. At present, the engineering samples have been shipped out and have been tested and confirmed in the HiSilicon laboratory. The test results show that the performance of the modified chip meets the requirements under all application conditions.
The design of this SoC project is extremely complex. It has a scale of more than 100 million gates, more than 8 cores, a high-speed clock system of up to 800MHz and a high-speed transmission interface of 3.125G.
The project is led by Cancore Semiconductor Shanghai, and its engineering team comes from different places, including Bangalore, India, Silicon Valley, California, and Shanghai, China. The tripartite partners agreed that close and harmonious cooperation, clear and reasonable planning, excellent and responsible project management and rigorous and perfect project execution are the main factors for the success of this urgent project.
"Through the cooperation of this 65-nanometer project, Cancore demonstrated how to use advanced technology, efficient project management, and friendly coordination with customers to complete the implementation of standard ASICs for high-performance SoCs," Cancore ’s president and CEO, Dr. Zhichun Xing said, "Canxin once again proved its ability to control the progress of the project to customers, helping customers shorten the product design cycle and improve the market competitiveness of their products."
"Although such a complex and huge high-end chip is not uncommon in North America, it is rare to complete the design within 4 months and a successful tape-out," said Naveed Sherwani, CEO of Open-Silicon. As always, provide customers with low-cost, high-reliability ASIC design services. "
"Canxin Semiconductor and Open-Silicon have made this project a timely and quality one-time tape-out with a rigorous and professional cooperation attitude and its advanced design process. This success once again proved their strength and won further respect from their peers,", He Tingbo, vice president of HiSilicon Semiconductor, was very satisfied with this cooperation and gave a pertinent evaluation. At the same time, he hoped that both parties could further strengthen the contact and deepen the cooperation.
About Canxin Semiconductor:
Cancore Semiconductor Co., Ltd. is a factory-less ASIC design service company dedicated to providing the most cost-effective, controllable and reliable customized ASIC solutions for all electronic product customers. Cancore Semiconductor is positioned at high-end design services and Turn-Key services below 90nm, providing customers with one-stop services from source code or netlist to finished chip products. Based on the customer first purpose and open service concept, Cancore Semiconductor provides customers with complete chip solutions, including wafer manufacturers, process nodes, IP, back-end design, packaging and test solutions, and final product solutions.
For more information, please browse or call 86-21-50277866.
About Open-Silicon:
Open-Silicon is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon can provide global customers with advanced ASIC and SoC design, proven open market IP integration and high-quality chip manufacturing services. Leveraging MAX Technologies technology, Open-Silicon continues to maintain technological advantages in areas such as low-power design, high-performance processor construction, diversity management, and low-cost testing, and assists customers in market success. Open-Silicon was recognized by the Global Semiconductor Alliance (GSA) in 2008 and was selected as the most respected private semiconductor company. For more information, please browse or contact.
About HiSilicon
HiSilicon is a semiconductor design company that provides customers with chips and solutions such as communication networks, wireless terminals, and digital media. The company is headquartered in Shenzhen and has design branches in Beijing, Shanghai, Silicon Valley, and Sweden. In the field of communication networks, HiSilicon can provide serial chips for fixed network, optical network, wireless network, data communication and network security; in the field of wireless terminals, WCDMA mobile phone chips and solutions are about to be launched; in the field of digital media, network monitoring has been launched Chips and solutions, videophone chips and solutions, DVB chips and solutions, IPTV chips and solutions, and digital TV chips and solutions.
Years of technology accumulation have enabled HiSilicon to master the world-class IC design and verification technology. It has advanced EDA design platforms, development processes and specifications. It has successfully developed more than 100 chips with independent intellectual property rights and applied for more than 400 patents. Based on the principle of mutual benefit and common development, HiSilicon has established good strategic partnerships with industry peers in the US, Japan, Europe, and China, and has established and stable cooperation channels for wafer processing, packaging, and testing.
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