[Text|High- tech LED reporter Gan Qin] The LED packaging industry has experienced the rise of medium-power devices in the previous two years, to the volume of COB devices last year, and to the recent explosion of EMC packaging products and flip-chip packaging products. The launch of each mainstream LED device has a certain impact on upstream materials, downstream market demand and related supporting supply chains.
However, despite the advancement of technology and packaging, the overall gross profit of the domestic LED packaging industry is declining, the middle and low-end overcapacity, and the homogenization competition are becoming more and more serious. All major packaging companies are actively innovating and seeking to break through. How to improve its profitability while gaining market share has become the primary consideration for packaging companies.
The industry believes that COB packaging will be an inevitable trend in the future development of LED packaging, because it has many advantages in heat dissipation, light distribution and cost. Relative to many small power arrays, because the light intensity is in parallel with the heat dissipation, the light intensity/thermal resistance ratio can be effectively increased. In addition, COB light sources are more convenient and easier to produce for downstream applications.
It is understood that the overall situation of COB market in 2014 is getting better, with an increase of 20-30%. Especially in the application field of COB devices, the products even occupy 40-50% of the market in some fields. The positive market also brings opportunities for the majority of packaging companies committed to COB.
"In the first quarter of this year, our COB packaged device shipments increased significantly, and revenues continued to increase. Currently, it has exceeded 40% of the company's total revenue." Yang Fan, general manager of Shenzhen Tongfang Optoelectronics, told Gaogong LED reporter.
"In the field of LED lighting, we are very optimistic about the future development of COB light source in the field of commercial lighting." Zou Yiming, general manager of Xinyue Optoelectronics told reporters that the future LED industry will pay more attention to the quality of light source products, the company will continue to focus on products. Improve the quality, and return more LED industry customers with more quality products.
At the same time, new packaging methods, including EMC packaging and flip-chip packaging, have also attracted more attention from enterprises, and have launched related products.
After nearly a year of trial and certification preparation, Xuyu Optoelectronics launched the highly cost-effective EMC 3030 SMD light source in March this year, and will be unveiled at this year's high-tech LED lighting exhibition.
Lin Jin, general manager of Xuyu Optoelectronics, said, “Because the installation structure of a single imitation lumen device is too cumbersome, EMC devices can use automatic placement machines for automatic placement, which saves labor costs and greatly Increased production efficiency."
The 2014 (4th) High-tech LED Exhibition will be moved to the Guangzhou Pazhou Canton Fair Complex on September 26-28, 2014. LED device companies participating in the exhibition this year can be described as the leading collection. At present, the companies that have already confirmed their participation are: Hongli Optoelectronics, Jingke Electronics, Chongqing Silian, Yimeixinguang, Xuyu Optoelectronics, Guangmai Electronics, Tongfang Optoelectronics, Getian Optoelectronics, Xinyue Optoelectronics, Xingguangbao, Zhonghao Optoelectronics, etc.
There are still 15 days from the opening of this high-tech LED. The preparations for the current exhibition are progressing smoothly. The 2014 (4th) High-tech LED Exhibition Organizing Committee said that the number of domestic and overseas professional buyers has exceeded the previous one.
In addition, in conjunction with the high-tech LED exhibition, the "12th High-tech LED Industry Summit Forum" was held. In addition to the theme forum, this forum also has a special conference for packaging lamps and lighting channels, aiming to comprehensively and deeply analyze the corporate brand marketing challenges brought about by the new stage of industrial development, and help enterprises better understand customer needs and do a good job. Maintenance and sublimation of supply chain partnerships.
However, despite the advancement of technology and packaging, the overall gross profit of the domestic LED packaging industry is declining, the middle and low-end overcapacity, and the homogenization competition are becoming more and more serious. All major packaging companies are actively innovating and seeking to break through. How to improve its profitability while gaining market share has become the primary consideration for packaging companies.
The industry believes that COB packaging will be an inevitable trend in the future development of LED packaging, because it has many advantages in heat dissipation, light distribution and cost. Relative to many small power arrays, because the light intensity is in parallel with the heat dissipation, the light intensity/thermal resistance ratio can be effectively increased. In addition, COB light sources are more convenient and easier to produce for downstream applications.
It is understood that the overall situation of COB market in 2014 is getting better, with an increase of 20-30%. Especially in the application field of COB devices, the products even occupy 40-50% of the market in some fields. The positive market also brings opportunities for the majority of packaging companies committed to COB.
"In the first quarter of this year, our COB packaged device shipments increased significantly, and revenues continued to increase. Currently, it has exceeded 40% of the company's total revenue." Yang Fan, general manager of Shenzhen Tongfang Optoelectronics, told Gaogong LED reporter.
"In the field of LED lighting, we are very optimistic about the future development of COB light source in the field of commercial lighting." Zou Yiming, general manager of Xinyue Optoelectronics told reporters that the future LED industry will pay more attention to the quality of light source products, the company will continue to focus on products. Improve the quality, and return more LED industry customers with more quality products.
At the same time, new packaging methods, including EMC packaging and flip-chip packaging, have also attracted more attention from enterprises, and have launched related products.
After nearly a year of trial and certification preparation, Xuyu Optoelectronics launched the highly cost-effective EMC 3030 SMD light source in March this year, and will be unveiled at this year's high-tech LED lighting exhibition.
Lin Jin, general manager of Xuyu Optoelectronics, said, “Because the installation structure of a single imitation lumen device is too cumbersome, EMC devices can use automatic placement machines for automatic placement, which saves labor costs and greatly Increased production efficiency."
The 2014 (4th) High-tech LED Exhibition will be moved to the Guangzhou Pazhou Canton Fair Complex on September 26-28, 2014. LED device companies participating in the exhibition this year can be described as the leading collection. At present, the companies that have already confirmed their participation are: Hongli Optoelectronics, Jingke Electronics, Chongqing Silian, Yimeixinguang, Xuyu Optoelectronics, Guangmai Electronics, Tongfang Optoelectronics, Getian Optoelectronics, Xinyue Optoelectronics, Xingguangbao, Zhonghao Optoelectronics, etc.
There are still 15 days from the opening of this high-tech LED. The preparations for the current exhibition are progressing smoothly. The 2014 (4th) High-tech LED Exhibition Organizing Committee said that the number of domestic and overseas professional buyers has exceeded the previous one.
In addition, in conjunction with the high-tech LED exhibition, the "12th High-tech LED Industry Summit Forum" was held. In addition to the theme forum, this forum also has a special conference for packaging lamps and lighting channels, aiming to comprehensively and deeply analyze the corporate brand marketing challenges brought about by the new stage of industrial development, and help enterprises better understand customer needs and do a good job. Maintenance and sublimation of supply chain partnerships.
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