As the competition for dressing chips is getting hotter and hotter, mid-stream packaging companies are thinking about how to get rid of the increase in revenue, a new chip packaging process has attracted the attention of the industry, and even many industry insiders predict that this process will become the future. The mainstream technology of LED packaging, this is the flip chip process.
This change is especially evident this year. In the past few years, only manufacturers with flip-chip technology as technology reserves, such as Ronda, Jingdian, and cross-strait optoelectronics, have launched new products based on flip chip technology, which further confirms the spring market of flip chip. .
Mr. Tang Guoqing, the general manager of Samsung LED China, made it clear that: 2014 LED flip chip technology is prevalent, its technical performance advantages and future market prospects will be more and more concerned by chips and packaging manufacturers, and will accelerate the LED packaging revolution. .
Flip chip development <br> <br> flip chip (Flip chip) originated in the 1960s by IBM developed the first, began to be used IC and application specific semiconductor products is a principle part of tin is deposited on the I / Opad Shot put, then flipping the chip to heat using a combination of molten tin shot balls and ceramic plates, this technology has replaced conventional wire bonding and is gradually becoming the trend of future packaging.
Philips Lumileds introduced flip-chip technology to the LED field for the first time in 2006. Since then, flip-chip eutectic technology has evolved and penetrated into chip-scale packages, creating a concept of package-free.
tips:
Positive chip: The earliest chip structure is also the chip structure commonly used in small power chips. In this structure, the electrode is on top, and the material from top to bottom is: P-GaN, luminescent layer, N-GaN, substrate. Therefore, it is a formal dress compared to flipping;
Flip-chip: In order to avoid the effect of the electrode on the LED in the pre-loaded chip and affect the luminous efficiency, the chip developer designed the flip-chip structure, that is, the flip-chip is inverted, so that the light excited by the luminescent layer is directly emitted from the other side of the electrode. The bottom is finally stripped, the chip material is transparent), and at the same time, the structure of the LED package factory wire bond is designed for the flip chip. Therefore, the whole chip is called a flip chip, and the structure is currently in a high power chip. More used.
Especially after the flip chip is applied in the field of LED packaging, the flip chip process has five distinct advantages compared to the conventional packaged chip. Deng Qiai, project manager of the two-storied optoelectronic flip chip, believes. First, after the flip-chip, the electrode directly contacts the heat-dissipating substrate, and does not pass through the sapphire heat dissipation, and can be used with a large current; the second is that the size can be made smaller, the optical is easier to match; the third is that the heat dissipation function is improved, and the life of the chip is extended; Wire the line to avoid the risk of disconnection; the fifth is to lay the foundation for the subsequent development of packaging process.
This change is especially evident this year. In the past few years, only manufacturers with flip-chip technology as technology reserves, such as Ronda, Jingdian, and cross-strait optoelectronics, have launched new products based on flip chip technology, which further confirms the spring market of flip chip. .
Mr. Tang Guoqing, the general manager of Samsung LED China, made it clear that: 2014 LED flip chip technology is prevalent, its technical performance advantages and future market prospects will be more and more concerned by chips and packaging manufacturers, and will accelerate the LED packaging revolution. .
Flip chip development <br> <br> flip chip (Flip chip) originated in the 1960s by IBM developed the first, began to be used IC and application specific semiconductor products is a principle part of tin is deposited on the I / Opad Shot put, then flipping the chip to heat using a combination of molten tin shot balls and ceramic plates, this technology has replaced conventional wire bonding and is gradually becoming the trend of future packaging.
Philips Lumileds introduced flip-chip technology to the LED field for the first time in 2006. Since then, flip-chip eutectic technology has evolved and penetrated into chip-scale packages, creating a concept of package-free.
tips:
Positive chip: The earliest chip structure is also the chip structure commonly used in small power chips. In this structure, the electrode is on top, and the material from top to bottom is: P-GaN, luminescent layer, N-GaN, substrate. Therefore, it is a formal dress compared to flipping;
Flip-chip: In order to avoid the effect of the electrode on the LED in the pre-loaded chip and affect the luminous efficiency, the chip developer designed the flip-chip structure, that is, the flip-chip is inverted, so that the light excited by the luminescent layer is directly emitted from the other side of the electrode. The bottom is finally stripped, the chip material is transparent), and at the same time, the structure of the LED package factory wire bond is designed for the flip chip. Therefore, the whole chip is called a flip chip, and the structure is currently in a high power chip. More used.
Especially after the flip chip is applied in the field of LED packaging, the flip chip process has five distinct advantages compared to the conventional packaged chip. Deng Qiai, project manager of the two-storied optoelectronic flip chip, believes. First, after the flip-chip, the electrode directly contacts the heat-dissipating substrate, and does not pass through the sapphire heat dissipation, and can be used with a large current; the second is that the size can be made smaller, the optical is easier to match; the third is that the heat dissipation function is improved, and the life of the chip is extended; Wire the line to avoid the risk of disconnection; the fifth is to lay the foundation for the subsequent development of packaging process.
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