On March 20th, the 5th LED Industry Theme Summit Forum was successfully concluded at Dongli Lake Hotel in Dongli District, Tianjin. The forum was organized by domestic well-known industry research, media organization Gaogong LED and Tianjin Dongli District People's Government, Tianjin. The city's Science and Technology Committee co-hosted nearly 300 industry leaders from across the country to participate in the forum. Speakers include Zhang Youhui, Secretary of Tianjin Dongli District, Chen Yansheng, Chairman of China Lighting Association, and Guan Baiyu, Deputy Inspector of Electronic Information Department of Ministry of Industry and Information Technology. Senior executives from industry bodies and governments, as well as Tang Guoqing, general manager of CREE China Market, Dr. Zong Mingcheng, Director of Solid State Lighting Standardization, Philips Lighting Asia Pacific, Yang Lan, Senior Sales Manager of OSRAM, Sun Hui, GE Systems Engineering Manager, and other international giants. There are many representatives and investors of domestic LED business leaders. This forum attracted nearly 300 high-level representatives from 136 companies in the LED industry in 19 provinces, cities and regions.
The topics of this forum cover the hot topics of current LED industry such as market opportunities, technology trends, and ten cities: semiconductor lighting technology and market forecast, LED street light technology, EMC and patent risks and countermeasures, LED market in 2010 Features and competitive factors, etc., including LED technology and all aspects of the market. Such as: semiconductor lighting technology, market status and prospects; LED lighting and standardization; EMC opportunities and risks; LED street lamp structure and system design; LED corporate financing, listing issues to pay attention to, etc., experts at each meeting, all aspects of the LED industry A thorough and in-depth discussion took place.
Prof. Fang Zhilie from Fudan University analyzed and forecasted the semiconductor lighting technology and market. Professor Fang told the audience to optimize the existing structure, optimize the materials, optimize the process, and then optimize the combination to achieve 161lm/W, 2mm2 chip 350mA. Up to 208 lm / W, the problem of commodification is not big, but the efficiency will increase and new technological breakthroughs are needed. Professor Fang pointed out that the current development trend of power LED package structure is size miniaturization, optical lens casting, thermoelectric path separation, thermal resistance minimization, planar patching, maximum junction temperature tolerance, and maximum luminous flux. Professor Fang quoted the statement of the Journal of the American Physical Society as saying, "In principle, the LED is the final form of the lamp, and its development can and will continue until all power and color are achieved."
Professor Fang Zhilie of Fudan University
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