1
human-computer interaction: it can interact with the customer, the response is reasonable and rapid.
When someone comes close to the display, the infrared sensor.
will receive the signal then display turned to the direction of the person automatically, when the middle of the switch (Figure 2) is aware of the presence of the front person then it will stop turning automatically.
When the person leaves , and no signal feedback, the display will return to the middle position.
2
Display with a display box, simple and clear, you can replace the sample quickly, and it with a security lock
3.
The display is controlled by one microcomputer, simple operation, easy to use
The data can be uploaded by U disk, it is fast and can play a variety of format files;
Microcomputer control contains wireless Wifi, can quickly connect to the wireless network
4.
The bottom of the display stand adopt horizontal adjustment of the horse wheel, easy to move and could be supported and level adjustment
5.
The display is with a storage box for small tools and cables
6.
Internal rotation structure is reliable, no need lubrication, no noise, smooth rotation;
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Technical Data:
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| Dimensions | Â 810*610*1870mm |
| Total power | Â 200W |
| Voltage/Frequency | Â 220V/50HZ |
| Rotation angle |  120° |
| Sensor | Â detection range of about 2m |
| Control | Â microcomputer |
| Display size | Â 32 inches |
| Total weight | Â 70kg |
Shandong Yuantong Century Intelligent Technology Co., Ltd Â
China Office:
No. 2999, 2nd Industry Road, Weifang Economic Development Zone,Shandong Province
Tel:+86 0536 8206275
UAE Office:
China National Building Material Group FZE,S30408 Jafza South near Gate No. 10
Tel:+971507988258Â
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HDI PCB Specification
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design is able to incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.
The HDI PCBs we offer include the following highly requested characteristics:
Blind and/or buried vias
Via-in-pad
Through vias from surface to surface
20 µm circuit geometries
30 µm dielectric layers
50 µm laser vias
125 µm bump pitch processing
Applications
HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.
HDI PCB
HDI PCB,Special HDI PCB,HDI Prototype PCB,HDI Board PCB
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